Sockets must be handled with care when mounting or removing sockets to/from BIB to avoid damaging sensitive spring contacts. Mounting holes size shown may differ depending on PEM nut selected. Requires two (2) #0-80 screws and PEM nuts for mounting (not supplied). See “PCB FOOTPRINT TOP VIEW” for requirements. Typical Average Burn-In Temperature = 150☌ Max. Contact Force = 16g per contact on 0.40mm pitch = 25g per contact on 0.50 - 0.75mm = 25g per contact on 0.80mm pitch or larger. Compression spring probe plating is 30u" min. Compression spring probes are heat treated Beryllium Copper Alloy. Machined socket components are UL94V-0 PEEK or Torlon. Molded socket components are UL94V-0 Ultem. Signal path during test only 0.077" (1.92mm). 4 Point crown insures “scrub” on solder oxides. Pressure pad compression spring provides proper force against device and allows for height variations in device thickness. Standard molded socket format can accommodate any device package of 6.5mm or smaller, by using machined (for small quantities) or custom molded (for large quantities) pressure pads and interposers. Small overall socket size/profile allows maximum number of sockets per BIB and BIB’s per oven, while being operator friendly. The gold over nickel plated compression spring probes leave very small witness marks on the bottom surface of the device solderballs. Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression spring probes which, are accurately located by two molded plastic alignment pins and mounted with two stainless steel screws. Any pitch device on 0.20mm pitch or higher. For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Applications:īest Online Shopping website for electronic Components & WIFI wireless module Transceiver Board in cheap price in Karachi, Lahore, Islamabad, Rawalpindi, Peshawar, Multan, Quetta, Faisalabad, and all over Pakistan By Pakluck. Pins are 0.6″ apart (fit into a 0.6″ socket) and 2.8mm (0.11″) long. Overall body size: 0.9″ x 2.6″ x 0.46″ (23mm x 66mm x 12mm) – not including lever or pins. Features of 40 Pin ZIF Socket:įits up to 40-pin DIP chips, in 0.3″-0.6″ width. These 2.54mm DIP sockets provide an excellent test and burn-in interface for dual in-line packages with a 2.54mm pitch and body width of 0.6 inches. These ZIF, or Zero Insertion Force sockets incorporate a lever which actuates the zero insertion force (ZIF) mechanism to help reduce damage to devices. Makes for easy connecting or programming to many DIP ICs. 
Compatible with 0.3″ up to 0.6″ wide ICs up to 40-pins. This is a high-quality, easy to use Zif Socket 40 Pin that is 0.6″ wide with gold-plated contacts.
ARIES 40 PIN ZIF SOCKET GOLD PLATED HOW TO
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